Basic Info.

Product Description

Technical description: material: fr-4 layer: 6 thickness of board: 1.2mm surface finish: immersion gold + osp min. hole size: 0.1mm(4mil) min.line width: 0.1mm(4mil) min.line space: 0.1mm(4mil) special technique: blind & buried vias+impedance control lamination:1-2,3-4, 5-6 use:mobile phone hitech circuits co., limited is a printed circuit board manufacturer/ pcb manufacturer in china, producing high quality, low cost barebones quick turn prototypes and medium production volumes printed circuit board, we specializing in pcb prototype, aluminium pcb, multilayer pcb (up to 26 layers), quick turn pcb, high density pcb / hdi pcb and low volume pcb production. our fabrication services offer high level of customization to suit all price and requirements. we founded in 1997, hitech circuits co., limited has grown into one of the largest and most experienced printed circuit board manufacturers in china. we are world leaders in thermal management technology development and take great pride in delivering excellent, attentive customer service.our team is here to help throughout your development process. every order gets a full review to ensure quality. we believe in true project ownership and proactively work to reduce error and give schedule updates. if you have interest in our service and products, please contact us freely.