Basic Info.
Product Description
Sps bis-(sodium sulfopropyl)-disulfide
intermediate for copper electroplating
1) cas no. 27206-35-5
2) molecular formula: c6h12o6s4na2
3) molecular weight: 354.4
4) einecs no. 248-324-3
5) applications: brightener in copper baths for decorative and functional deposits
6) appearance: white or yellowish powder
7) concentration in the bath:10-100mg/l
8) ph value: 3-7(38%water solution)
9) storage condition: stored in cool and dry place
10) valid period(year): 2
Company Profile
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Business Type: |
Electroplating additive, nickel plating, electroplating chemicals,
electro plating |
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Comapany: |
Hubei lingzhi chemicals technology industry co., ltd |
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Address: |
12 floor, incubation building, wuhan institute of technology, wuhan, china |
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City: |
Wuhan |
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Zip/Postal: |
430074 |
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State: |
Hubei |
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Country: |
China |
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